01.
Product
DESCRIPTION
Specifciation of Copper alloy lead frame:
★ The raw material for lead frame is Copper alloy.The product needs to be stamped and partial gold-plated.the thickness is 0.20mm.
★ In order to meet the mechanical properties and cost savings, the lead frame needs to be partially gold plated after stamping.
★ Because the lead frame can meet the high strength, high thermal conductivity, and the material has good brazing performance, process performance, corrosion resistance, so the customer for the product performance is very recognized
★ No pollution to environment. Part complies with RoHS.
★ The stamping speed is around 300-500 times/ min.
Parameter of Copper alloy lead frame | |||
Place of Origin | Guangdong, China (Mainland) | Application | electronics |
Material | copper alloy | Surfacetreatment | gold plating |
Size | 35*28*20mm | Usage | connecting |
Color | golden | Special | OEM/ODM is welcome |
Certificate | IATF16949 ISO14001 SGS RoHS | Other | N/A |
Packaging & Delivery | |||
Single package size | 55*48*35 cm | Package Type | Plastic tray and exported carton |
Single gross weight | 9 kg | Lead Time | 15 days |
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