01.
Product
DESCRIPTION
Specifciation of Partially silver-plated metal stamping lead frame:
★ Gennerally, The raw material for lead frame is C5191 with excellent electrical conductivity.The product needs to be stamped before plating, and then cutiting. The thickness is 0.30mm.
★ In order to meet the mechanical properties and cost savings, the lead frame needs to be partially silver plated after stamping.
★ The lead frame is a thin metal frame to which the semiconductor is attached during package assembly. The quality of the lead frame is critical: any minor defect can seriously compromise the performance and reliability of the final IC device.
★ No pollution to environment. Part complies with RoHS.
★ The stamping speed is around 500 times/ min.
Parameter of Partially silver-plated metal stamping lead frame | |||
Place of Origin | Guangdong, China (Mainland) | Application | New energy |
Material | C5191 | Surfacetreatment | sliver plating |
Size | 45*38*25mm | Usage | touching |
Color | sliver and copper color | Special | OEM/ODM is welcome |
Certificate | IATF16949 ISO14001 SGS RoHS | Other | N/A |
Packaging & Delivery | |||
Single package size | 55*48*35 cm | Package Type | Plastic tray and exported carton |
Single gross weight | 13 kg | Lead Time | 15 days |
QUALITY CONTROL
Our quality team uses high-precision instruments to inspect the product every hour to meet the accuracy and yield requirements of the product.
PACKING
Based on the product's structural process, product weight, shipping requirements and customer requirements, our process engineers will evaluate the right packaging solutions for the product, which are fully compliant with all shipping conditions and modes of transport. The main packaging methods include bulk packaging, plastic pallet packaging, carrier tape packaging and reel packaging.
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