01.
Product
DESCRIPTION
Specifciation of Partial gold plated lead frame:
★ The raw material for lead frame is C17200 with excellent electrical conductivity.The product needs to be stamped before plating. The thickness is 0.30mm.
★ In order to meet the mechanical properties and cost savings, the lead frame needs to be partially gold plated after stamping.
★ The lead frame is a thin metal frame to which the semiconductor is attached during package assembly. The quality of the lead frame is critical: any minor defect can seriously compromise the performance and reliability of the final IC device.
★ No pollution to environment. Part complies with RoHS.
★ The stamping speed is around 300-500 times/ min.
Parameter of Partial gold plated lead frame | |||
Place of Origin | Guangdong, China (Mainland) | Application | New energy |
Material | C17200 | Surfacetreatment | gold plating |
Size | 45*38*25mm | Usage | connecting |
Color | golden | Special | OEM/ODM is welcome |
Certificate | IATF16949 ISO14001 SGS RoHS | Other | N/A |
Packaging & Delivery | |||
Single package size | 55*48*35 cm | Package Type | Plastic tray and exported carton |
Single gross weight | 13 kg | Lead Time | 15 days |
QUALITY CONTROL
Our quality team uses high-precision instruments to inspect the product every hour to meet the accuracy and yield requirements of the product.
PACKING
Based on the product's structural process, product weight, shipping requirements and customer requirements, our process engineers will evaluate the right packaging solutions for the product, which are fully compliant with all shipping conditions and modes of transport. The main packaging methods include bulk packaging, plastic pallet packaging, carrier tape packaging and reel packaging.
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