Integrated circuit lead frame progressive die

Progressive dies for integrated circuit lead frames that represent high-performance levels, mainly include integrated circuit frames, transistor frames, and discrete device frames. The molds are used on high-speed punching machines to punch copper strips with a material thickness of 0.02mm. The lead frame is formed by stamping. As a carrier lead frame for high-performance semiconductors and integrated circuits, it is characterized by a large number of leads, small leg spacing, and high precision. The punched-out products require no burrs at the plating. Among the lead frame mold products independently developed in China, the largest number of lead legs is 128, the smallest spacing is only 0.09mm, and the frame with the largest number of rows has reached 8 rows. The mold level is equivalent to that of similar international molds.　　 For example, LQP48L lead frame progressive die, 37 stations, manufacturing accuracy of 2μm, 3 rows of molds, punching 48 inner and outer lead legs in 12×12mm, minimum spacing of 0.12mm, product flatness within 0.01mm. Its high-speed batch production performance and life are not inferior to similar international molds. Lead frame 35-station progressive die, 46-station multi-row and multi-column lead frame progressive die, integrated circuit lead frame 64-leg progressive die, etc., solve the technical problems of punching with large number of legs, small spacing and high precision. The mold level is equivalent to the international level.