Lead frame, semiconductor lead frame stamping processing plants

Lead frame is an important basis of integrated circuit with copper belt material l materials, precision stamping factory semiconductor lead frame is the typical high electronic stamping parts. Dongguan precision electronic technology co. , LTD. , established in January 2008, is a professional design and manufacture of precision stamping die and precision metal lead frame of ODM/OEM manufacturer for TS16949, ISO9001, ISO14000 management system certification. Lead frame as integrated circuit chip carrier, is a kind of with the aid of bonding material ( Gold, aluminum wire, copper wire) For chip internal circuit outside the terminal and the electrical connection in the lead, the electric circuits of the formation of key parts, which serve as the bridge between the external and wire connection, the vast majority of semiconductor integrated block you need to use lead frame, is the important basic materials in electronic information industry. Metal stamping factory design team have: first-class high-speed stamping die within manufacturing monthly development more than 20 sets of mould capacity, a lead frame die finish time is the fastest time for 14 days. Has punch press imported from ( Taiwan and Japan) Stamping equipment: lead frame high precision grade ( Punching accuracy of plus or minus 0. 1毫米) And faster, SPM1500) 。 30 years electronic stamping custom experience, seiko quality, committed to global service. Precision contact: wish you a prosperous business, everything goes well, if you want to learn more dynamic, can scan the qr code, pay attention to the public. , is committed to precision stamping processing factory of the world's most professional electronic components