The characteristics of electronic stamping parts in daily processing

Electronic stamping parts are very common in daily life applications. As a person with more than 20 years of experience in the stamping industry, mold design and manufacturing are familiar with short and long, and they are usually more proficient when assembling molds. Then our masters will know how to assemble molds. What to pay attention to, they also put forward a few tips, let’s learn together; when assembling electronic stamping parts, we should try our best to lock the screws from the front and hit the pins such as guide posts and guide sleeves. We should also try our best to meet this request when designing. In this way, the mold assembly and disassembly will be more convenient, and the workload will be greatly reduced. Assuming that the male and female molds of the mold are heavier and relatively large in size, you must drill the hook screw holes to facilitate the disassembly and assembly of the mold as a fitter. When assembling electronic stamping parts, pay attention to the direction, and make the direction and mark of the mold assembly if necessary. When assembling the guide pin and guide sleeve of the mold, be sure to avoid installing it backwards. Stamping parts processing plants process stamping products used in various industries, including electronic stamping parts. Electronic stamping parts products have their weird characteristics in daily processing. Let’s take a look at which ones? The number of processes in the processing of electronic stamping parts is related to the nature of the material, the stretching height, the stretching step, the stretching diameter, the material thickness and other conditions; the cleaning process of the electronic stamping parts includes alkaline cleaning, solvent cleaning, surfactant cleaning and other chemistry Cleaning method: The adhesion between the plating layer of electronic stamping parts and the substrate is the link to ensure the quality of electroplated products. Before the electroplating of the substrate material, there will be various dirt on the surface, such as (cutting fluid, lubricating fluid, polishing paste, etc.). The cleanliness of the surface of the base material directly affects the adhesion of the electroplated layer, and the oily surface must be cleaned. The characteristics of electronic stamping forming: 1. When forming by stamping technology, the value of the internal stress of the scaffold fastener blank is greater than or equal to or less than the yield strength stress of other materials. In this regard, stamping and forming have a big difference in volume. Therefore, the main component of the hydrostatic environment pressure in the stress development of the deformation zone during the stamping process has lost its important role in the volume forming process. Under some corporate conditions, we can even pass the rejection Consider, even when there are considerations, the processing methods are not the same. Second, during stamping forming, the mold has a lighter effect on the effect of the scaffold fastener blank. Unlike volume forming (such as die forging), it is formed by completely contacting the blank with a cavity shaped like the workpiece. In stamping and forming, in most cases, the bracket fastener blank has a certain degree of freedom, often as long as the mold touches the surface, accidentally or even the two surfaces of the bracket coupler have touched the deformed side of the mold. In this development situation, the deformation of this one-sided blank is achieved by the external force exerted by the mold on the two adjacent one-sided students to achieve its control teaching effect. For example, this is the case for the bead portion and the blank sheet surface of the tube end portion and the tapered portion during the forming of the spherical molded product. 3. The pressure per unit building area perpendicular to the direction of the board surface is not large enough to cause plastic material deformation of the scaffold fastener system in the direction of the board surface. Since the pressure per unit area perpendicular to the direction is much smaller than the internal stress in the direction, most scaffold fasteners can be approximated as plane stress. Deformation mechanics analysis and process parameter calculation are greatly simplified. Fourth, since the comparative thickness of the bracket fastener blanks formed by compression molding is small, the buckling resistance according to the pressure action may be poor, so in the absence of anti-buckling devices (such as binder rings, etc.), it is free of conditions The end is smoothly stamped in a difficult process. Therefore, the elongation stamping process, which mainly focuses on tension effect analysis, is more than the compression molding process, which focuses on pressure management effect evaluation.