The characteristics of using electron beam to process small holes in the machinery industry

Electron beam processing is under vacuum conditions, using the focused electron beam with extremely high energy density to impact a very small area on the surface of the workpiece at a very high speed. In a very short time, most of its energy is converted into thermal energy, so that The workpiece material in the impacted part reaches a high temperature of several thousand degrees Celsius, which causes the local gasification of the material and is sucked away by the vacuum system. At present, holes with a diameter of less than 3um can be processed, which is particularly advantageous for the drilling of many parts in the field of microelectronics. It is an indispensable processing method in the processing of micro-holes. Characteristics of electron beam processing ①Theoretically, electron beam processing can process small holes with a diameter of less than 1um. At the same time, the length of the thinnest part after the electron beam is focused is dozens of times the diameter of its cross-section, so it is suitable for processing small deep holes ②The intensity and position of the electron beam are easily controlled by the magnetic field and electric field, so it is easy to program control , Realize automatic high-speed small hole drilling ③ When electron beam drilling small holes, the force is small, the stress and deformation are small, and it can be used on brittle materials, ductile materials, conductors and non-conductors. ④ The electron beam small holes are made in a high vacuum It is carried out in medium, almost completely avoids the oxidation phenomenon in air processing, and is especially suitable for drilling small holes in easily oxidized materials and semiconductor materials with extremely high purity requirements. ⑤Electron beam drilling requires tens of thousands of volts of acceleration voltage and pumping height. Vacuum equipment is more complicated and expensive. Therefore, it has certain limitations in production and application. At present, it is mainly used in the field of microelectronics industry. Previous: Features of Ultrasonic Machining in Small Hole Machining Process