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What are the characteristics of the mobile phone motherboard shielding cover, foreign cupronickel material + raw materials imported from the original national standard
According to Hardware, the manufacturer of shielding covers for mobile phone motherboards, nickel silver is a common metal raw material used by many customers when choosing shielding covers. It has the advantages of good shielding effect and strong tinning performance. Xiaoshuo will first understand the performance of Xiayang Cupronickel with everyone: Silver Cupronickel is an alloy material. It has beautiful color, ductility, fatigue resistance and corrosion resistance, and is rich in deep drawing performance. Uses: mobile phone shielding cover, liquid crystal oscillating element shell, crystal shell, sliding plate for potentiometer, medical machinery, construction, Wind instruments and so on. Mechanical properties of nickel silver: Alloy mark: C7521R-H Tensile test: Thickness/mm: ≥0.2-≤5 Tensile strength/Mpa: ≥540 Elongation/%: ≥3 Bending test: Thickness/mm: ≤1.6 Bending Angle: Not measured. Inside radius: 2 times the thickness of nickel silver. The tinning performance is better. Nickel-nickel alloy is a copper-based alloy with nickel as the main additive element. It is silver-white with metallic luster, hence the name copper-nickel alloy. Copper and nickel can be infinitely dissolved in each other to form a continuous solid solution, that is, regardless of the ratio of each other, it is always an α-single-phase alloy. When nickel is melted into red copper and the content exceeds 16%, the color of the resulting alloy becomes as white as silver. The higher the nickel content, the whiter the color. The nickel content in cupronickel is generally 25%. Hardware, 15 years of focusing on mobile phone motherboard shielding, 2 days of proofing and 4 days of mold making, daily production capacity of 3 million strokes, 16 quality inspections are strictly controlled. In the production of nickel silver shield, the flatness is controlled within 0.07mm, which greatly solves the problem of false welding in SMT patches.