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What are the disadvantages of the use of metal shrapnel
The metal shrapnel, made of stainless steel, is an important part of the switch. With the help of the conductivity of the metal shrapnel, it acts as a high-quality switch between the operator and the product. At the same time, using the stable resilience of the metal shrapnel (automatically return after pressing down), and the long life, provide the operator with high quality tactile feedback. Shrapnel is mainly used in membrane switches of rigid boards such as printed circuit boards. The following China Spring Trading Network will introduce some defects of metal shrapnel during use. Metal shrapnel without dots, such as round shrapnel, waist round shrapnel diameter 4mm, 5mm and other metal shrapnel, are mostly used in micro switches, mobile phones, remote control and other products, there are also cross-shaped shrapnel, such as diameter 6mm to 12mm, Most of them are used in membrane switches, PCB boards and other products. The conduction performance of the metal shrapnel conductive film of such products is relatively high. This type of product is produced in a dust-free workshop, but it is difficult to control a little dust. The metal shrapnel without dots is used. The contact surface between the metal shrapnel and the circuit is relatively large. If dust enters, the defective rate of the conduction performance of the metal shrapnel will increase. The dotted metal shrapnel has a protruding point in the middle. This product only has a point in the middle of the metal shrapnel that is in contact with the circuit. When dust enters, the dust will only be around the bumps, and will not stick to the bumps. Point, if there is dust on the bump, you can press a few more times to make the dust fall off and break automatically. This effectively reduces the defective rate of conduction performance, and at the same time, the metal shrapnel can also reach the standard conduction performance. In this way, the defective rate of the conduction performance of the metal shrapnel is reduced.