What material makes the shielding cover effective, and what is the process flow of the motherboard shielding cover?

What material makes the shielding cover effective, and what is the process flow of the motherboard shielding cover? Nowadays, everyone is familiar with shielding covers, but there are many materials for shielding covers. Hardware recommends that two commonly used materials are used to make shielding covers: nickel silver and tinplate. Tinplate is relatively cheap, has better weldability, and is easy to process. However, long-term placement of the finished product will easily damage the surface structure and produce black rust, which will affect the weldability. This is its only defect. In addition, the material of tinplate is relatively soft, so it is not suitable for a relatively large and narrow shield. Based on the above, Xiao Rui suggests that tinplate should be given priority to make shielding cover if the cost is considered. Regardless of the cost, only the effect is selected to make the shielding cover of white copper, which has a strong shielding effect and good tinning performance. The main board shielding cover process: material inspection → performance inspection → size inspection → salt spray inspection → appearance inspection → hardness inspection → first piece confirmation → production inspection → finished product sampling → packaging material inspection → packaging first piece inspection → quantity and weighing inspection →Label detection →Finally, every step of the IQC shipment report is essential to ensure stable quality. What material makes the shielding cover effective, and what are the process flow of the motherboard shielding cover? The common choice of well-known companies. High output. 3000000 punching times per day. Precision stamping parts. Good quality. Precision of ±0.01mm. 16 process flow. QC strict quality inspection. . For more information, welcome to consult