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Product
DESCRIPTION
Specifciation of Copper alloy lead frame:
★ The raw material for lead frame is Copper alloy.The product needs to be stamped and partial gold-plated.the thickness is 0.20mm.
★ In order to meet the mechanical properties and cost savings, the lead frame needs to be partially gold plated after stamping.
★ Because the lead frame can meet the high strength, high thermal conductivity, and the material has good brazing performance, process performance, corrosion resistance, so the customer for the product performance is very recognized
★ No pollution to environment. Part complies with RoHS.
★ The stamping speed is around 300-500 times/ min.
PRODUCT PARAMETERS
Parameter of Copper alloy lead frame | |||
Place of Origin | Guangdong, China (Mainland) | Application | electronics |
Material | copper alloy | Surfacetreatment | gold plating |
Size | 35*28*20mm | Usage | connecting |
Color | golden | Special | OEM/ODM is welcome |
Certificate | IATF16949 ISO14001 SGS RoHS | Other | N/A |
Packaging & Delivery | |||
Single package size | 55*48*35 cm | Package Type | Plastic tray and exported carton |
Single gross weight | 9 kg | Lead Time | 15 days |
PRODUCT ADVANTAGES
Description and advantage of Copper alloy lead frame
QUALITY CONTROL
Our quality team uses high-precision instruments to inspect the product every hour to meet the accuracy and yield requirements of the product.
PACKING
Based on the product's structural process, product weight, shipping requirements and customer requirements, our process engineers will evaluate the right packaging solutions for the product, which are fully compliant with all shipping conditions and modes of transport. The main packaging methods include bulk packaging, plastic pallet packaging, carrier tape packaging and reel packaging.