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Product
DESCRIPTION
Specifciation of Sliver plated precision stamping lead frame:
★ The raw material for lead frame is pure copper(C1100).The product needs to be stamped and then sliver plated. The thickness is 0.35mm.
★ For mechanical properties, lead frames need to be tinned after stamping.
★ The lead frame is a thin metal frame to which semiconductor is attached during package assembly. The quality of the lead frame is critical: any minor defect can seriously compromise the performance and reliability of the final IC device.
★ No pollution to environment. Part complies with RoHS.
★ The stamping speed is around 400 times/ min.
PRODUCT PARAMETERS
Parameter of Sliver plated precision stamping lead frame | |||
Place of Origin | Guangdong, China (Mainland) | Application | electronics |
Material | C1100 | Surfacetreatment | sliver plating |
Size | 45*20*15mm | Usage | connecting |
Color | sliver | Special | OEM/ODM is welcome |
Certificate | IATF16949 ISO14001 SGS RoHS | Other | N/A |
Packaging & Delivery | |||
Single package size | 55*48*35 cm | Package Type | Plastic tray and exported carton |
Single gross weight | 9 kg | Lead Time | 15 days |
PRODUCT ADVANTAGES
Description and advantage of Sliver plated precision stamping lead frame
QUALITY CONTROL
Our quality team uses high-precision instruments to inspect the product every hour to meet the accuracy and yield requirements of the product.
PACKING
Based on the product's structural process, product weight, shipping requirements and customer requirements, our process engineers will evaluate the right packaging solutions for the product, which are fully compliant with all shipping conditions and modes of transport. The main packaging methods include bulk packaging, plastic pallet packaging, carrier tape packaging and reel packaging.