Metal stamping lead frame for connector can be quickly disassembled and replaced.
这里可以自定义设置
01.
Product
DESCRIPTION
Specifciation of Electronic component lead frame:
★ The raw material for lead frame is Phosphor copper.The product needs to be stamped. The thickness is 0.20mm.
★ In order to meet the mechanical properties and cost savings, the lead frame needs to be partially gold plated after stamping.
★ The lead frame has a number of similar wire ends, and the process of wire end production is extremely tedious, the conductive effect is good, and it can maintain stable physical and mechanical properties under high temperature environment, and is not easy to deformation and melting.
★ No pollution to environment. Part complies with RoHS.
★ The stamping speed is around 300-500 times/ min.
Parameter of Electronic component lead frame | |||
Place of Origin | Guangdong, China (Mainland) | Application | electronics |
Material | C5191 | Surfacetreatment | NA |
Size | 45*38*25mm | Usage | connecting |
Color | Material color | Special | OEM/ODM is welcome |
Certificate | IATF16949 ISO14001 SGS RoHS | Other | N/A |
Packaging & Delivery | |||
Single package size | 55*48*35 cm | Package Type | Plastic tray and exported carton |
Single gross weight | 9 kg | Lead Time | 15 days |
QUALITY CONTROL
Our quality team uses high-precision instruments to inspect the product every hour to meet the accuracy and yield requirements of the product.
PACKING
Based on the product's structural process, product weight, shipping requirements and customer requirements, our process engineers will evaluate the right packaging solutions for the product, which are fully compliant with all shipping conditions and modes of transport. The main packaging methods include bulk packaging, plastic pallet packaging, carrier tape packaging and reel packaging.
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