These products are commonly used in IC integrated circuit lead frames primarily including discrete device lead frames and integrated circuit lead frames. The thickness of the product is generally 0.2mm, 0.25mm, 0.3mm. Typically, the product is strip-shaped and requires injection molding. It is widely used in the electronics field.

Generally, the thickness of the raw material can be processed in the range of 0.05 mm to 3.0 mm. The raw materials we supply include beryllium copper (heat treatment required), phosphor bronze, copper, brass, stainless steel, iron, aluminum, etc. We use the corresponding raw materials according to the customer's drawings or recommend materials for the customers to meet the performance requirements of the products.All raw materials comply with international RoHS standards.

According to the drawings, we can apply different surface treatment technologies such as nickel plating, tin plating, gold plating, silver plating, etc. to the product. We can also passivate, anodize, degrease and other surface treatment processes to meet different product technical parameters.

Our quality team uses high-precision instruments to check the production process every hour to achieve high product accuracy and yield.

The main packaging methods we provide are bulk packaging, plastic pallet packaging, carrier tape packaging and reel packaging. According to the product structure, product weight, transportation requirements and customer requirements, our process engineers will determine the appropriate packaging solution for the product. These solutions are perfectly suited to a variety of transportation conditions and modes of transport.