Specifciation of Strong conductivity stamping lead frame:

★  The raw material for lead frame is Copper-zinc alloy. The product is  electroplated using raw materials,with copper as the base and then matte tin plating. product needs to be stamped. The thickness is 0.3mm.

★ For mechanical properties, lead frames need to be tinned after stamping.

★ The lead frame is a thin metal frame to which  semiconductor is attached during package assembly. The quality of the lead frame is critical: any minor defect can seriously compromise the performance and reliability of the final IC device.

★ No pollution to environment. Part complies with RoHS.
★ The stamping speed is around 400 times/ min.

★The product is subjected to a minimum of 8 hours of salt spray testing

At Dogguan Fortuna, we can customize progressive dies for such parts according to customer requirements and drawing parameters. We spare no effort to meet high speed production and provide our customers with quality quantities.